I like Craige_Hales solution, but I also want to provide my solution as I have been faced with similar tasks in the past.
My approach was to use the available data to calculate additional information, add this to the data table, and then I was able to generate reports (graph builder, tabulate, etc) that showed the final results.
In your request, you want be be able to calculate the number of times a particular serial ID has been processed. I have also found it very useful to create an indicator column that identifies data entries from the last/final processing of a wafer.
Based on the example data from "mock data.PNG", I would do the following:
- calculate the sequential number for each time a wafer has been processed
- calculate the final time each wafer was processed
- identify defect locations by name based on approximate locations
- calculate the number of times each location name has been identified for each wafer
To accomplish this I generate several temporary data tables using tabulate, add some formulas to get the answers I want, and then merge them back into the original data table.
The JSL code would look something like this
names default to here(1);
/////////// make example data table /////////////////////
dt = New Table( "example data set",
Add Rows( 13 ),
New Column( "Time",
Numeric,
"Nominal",
Format( "Best", 12 ),
Set Values( [1, 1, 1, 1, 1, 2, 2, 2, 3, 3, 4, 4, 4] )
),
New Column( "WaferID",
Numeric,
"Nominal",
Format( "Best", 12 ),
Set Values( [1, 1, 1, 1, 1, 2, 2, 2, 3, 3, 1, 1, 1] )
),
New Column( "X location",
Numeric,
continuous,
Format( "Best", 12 ),
Set Values(
[2.745, 1.566, -28.143, -4.793, -29.251, 19.527, 6.581, 29.37, 4.907,
21.699, 2.745, -4.793, 6.581]
)
),
New Column( "Y location",
Numeric,
continuous,
Format( "Best", 12 ),
Set Values(
[44.164, 61.915, -42.954, -38.091, -46.659, 32.201, -24.715, 41.533,
60.217, -60.26, 44.164, -38.091, -24.715]
)
),
New Column( "Size",
Numeric,
"Continuous",
Format( "Best", 12 ),
Set Values(
[0.164, 0.136, 0.125, 0.122, 0.122, 0.036, 0.035, 0.035, 0.035, 0.034,
0.164, 0.122, 0.035]
)
)
);
//dt = current data table();
/////////// create temporary data table to determine Clean Count and Final Clean /////////////////
tab = dt << Tabulate(
Show Control Panel( 0 ),
Full Path Column Name( 1 ),
Add Table( Row Table( Grouping Columns( :WaferID, :Time ) ) )
);
dtx = tab << make into data table();
tab << close window();
dtx << New Column("Wafer Clean Count", Numeric, "Nominal", Formula(Col Rank(:Time, :WaferID)));
dtx << New Column("Final Wafer Clean", Numeric, "Nominal", Formula(If(:Time == Col Maximum(:Time, :WaferID), 1, 0)));
dtx << delete Column("N");
///////// move Clean Count and Final Clean information back to original data table //////////////
dt << Update(
With( dtx ),
Match Columns( :WaferID = :WaferID, :Time = :Time ),
Add Columns from Update Table( :Wafer Clean Count, :Final Wafer Clean ),
Replace Columns in Main Table( :Wafer Clean Count, :Final Wafer Clean )
);
//////// close data table //////////////////////////////////////////////////////
close(dtx, no save);
//////// modify X & Y values to allow variation in measurements////////////////
dt << new column("X_Temp", numeric, continuous, formula(round(:X location, 1)));
dt << new column("Y_Temp", numeric, continuous, formula(round(:Y location, 1)));
/////// create temporary data table to name defect locations ///////////////
tab = dt << Tabulate(
Show Control Panel( 0 ),
Include missing for grouping columns( 1 ),
Full Path Column Name( 1 ),
Add Table( Row Table( Grouping Columns( :X_Temp, :Y_Temp ) ) )
);
dtx = tab << make into data table();
tab << close window();
dtx << new column("Location", character, nominal, formula("L" || char(row())));
dtx << delete column("N");
//////// move Location information back to original data table ////////////////
dt << Update(
With( dtx ),
Match Columns( :X_Temp = :X_Temp, :Y_Temp = :Y_Temp ),
Add Columns from Update Table( :Location ),
Replace Columns in Main Table( :Location )
);
/////// clean up /////////////////////////
close(dtx, no save);
dt << delete columns(
{
"X_Temp",
"Y_Temp"
}
);
/////// calculate the number of times a defect location occured on a given wafer ////////
dt << new column("Wafer Location Count", numeric, nominal, formula(Col Rank( :Time, :Location, :WaferID )));
/////// make some reports /////////////
nw = new window("results",
h list box(
gb = dt << Graph Builder(
Show Control Panel( 0 ),
Variables(
X( :X location ),
Y( :Y location ),
Group X( :Wafer Clean Count ),
Group Y( :WaferID ),
Color( :Wafer Location Count )
),
Elements( Points( X, Y, Legend( 7 ) ) )
),
tab = dt << Tabulate(
Show Control Panel( 0 ),
Include missing for grouping columns( 1 ),
Full Path Column Name( 1 ),
Add Table(
Column Table( Statistics( Max ), Analysis Columns( :Wafer Location Count ) ),
Row Table( Grouping Columns( :WaferID, :X location, :Y location ) )
),
Local Data Filter(
Add Filter(
columns( :Final Wafer Clean ),
Where( :Final Wafer Clean == 1 )
)
)
)
)
);
When naming the defect locations, I rounded the x coordinate and the y coordinate to one decimal place to allow for some variation in the position measurements. This may or may not be sufficient for your needs, but this approach allows you to modify the formula for X_Temp and Y_Temp and the rest will still work as expected.
The resulting data table contains the following additional columns:
- Wafer Clean Count
- contains the sequential number for the number of cleaning performed on the wafer
- Final Wafer Clean
- indicator column which is zero if the entry is not the final time the wafer was processed and a one if it is the final time the wafer was processed
- Location
- a name assigned to the approximate defect location
- Wafer Location Count
- contains the sequential number of times this defect location name has occurred on any given wafer
With the resulting data table, one would be able to address the questions you asked and more. Some of the possible questions that could be investigated include but are not limited to:
- which defect locations have persisted after multiple cleaning cycles
- what is the overall defect rate after the first wafer cleaning cycle
- what is the overall defect rate after all cleaning cycles have been performed
- what is the average number of cleaning cycles per wafer
- are there areas that consistently have defect areas that require cleaning
I hope this help.
