Structured Problem-Solving Approach: Efficient Root Cause Identification (2025-US-30MP-2438)

In the semiconductor manufacturing enviroment, it is critical to maintain product yield, cycle time, and quality, due to the costly and complex process. Maintaining process stability and ability to recover from out of control situations are of utmost importance for product quality, cost, and delivery.

Using a structured problem-solving approach has been highly successful to quickly and systematically identify the root cause and solution to return a product or process to normal in a disciplined way and a minimal timeframe.

NXP has been developing and enhancing the capability and definition of structured roblem solving, integrated with well known Six SIgma methodology. 

This presentation shares how to enhance the effectiveness and efficiency to narrow down multiple potential root causes into a few most likely ones by using statistical modeling and screening techniques in JMP that are integrated with basic Six Sigma tools, such as 8D, IS-SINOT, and fault tree analysis.