Using JMP as an SPC Interface (2025-US-PO-2533)
Companies often rely on outdated software for statistical process control (SPC) to monitor manufacturing processes. Numerous other SPC programs are in use by industry, but companies often stick with legacy programs that make data analysis and presentation difficult for users.
This poster presents a method to create SPC charts to present film thickness data for furnaces that are commonly used to run large batches of wafers in the semiconductor industry. These large-batch furnaces have a multitude of factors that can influence thickness results. There are severeal advantages of relaying this information in JMP Graph Builder, including:
- All equipment can be displayed on the same chart.
- All zones of the furnace can be readily evaluated.
- It is easy to filter through multiple parameters that contribute to thickness outputs.
Since JMP can readily displaying information and has great interactivity to identify issues, it helps engineers make decisions with greater confidence.